PN Type Package Designator Pb-Free Packages - Manufacturing Conversion Datecode, Refer to Note 1 Type of Plating / Finish Matte Tin Annealing Process Minimum Plating Thickness Does this Microchip Pb-free device meet RoHS compliance for the following 6 materials: Pb, Hg, Cr6+, Cd, and PBB / PBDE Total Mass (g) STANDARD All Date CodesMatte Tin150C / 1hr w/l 24 hours400 microinchesYes0.0160
MCP6541UT-E/OT |
RFQ for MCP6541UT-E/OT |
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| Technical/Catalog Information | MCP6541UT-E/OT |
| Vendor | Microchip Technology (VA) |
| Category | Integrated Circuits (ICs) |
| Type | General Purpose |
| Output Type | CMOS, Push-Pull, Rail-to-Rail, TTL |
| Voltage - Supply | 1.6 V ~ 5.5 V |
| Number of Elements | 1 - Single |
| Package / Case | SOT-23-5 |
| Packaging | Digi-Reel? |
| Lead Free Status | Lead Free |
| RoHS Status | RoHS Compliant |
| Other Names | MCP6541UT E OT MCP6541UTEOT MCP6541UT E OTDKR ND MCP6541UTEOTDKRND MCP6541UT-E/OTDKR |
| Product | Manufacturers | Pack | D/C | ||||||||
| MCP6541UT-E/OT | - | - | - |